TheInternationalStudent Scholarshipsare a testament toBond University's commitment to quality and outstanding international students. These scholarships are available to international students who have demonstrated outstanding academic ability (academic merit based scholarships).
Value
25% to 50% of tuition fees of anyundergraduateorpostgraduatedegree (excluding Bond University'sMedicalProgram,MasterofPsychology, Doctor of Physiotherapy)
Availability
10 x 25% scholarships annually
10 x 50% scholarships annually
Eligibility
- Available for international students only, for undergraduate or postgraduate study.
- Applicants must currently be or have previously been in the top 5% of their high school or university class.
- Students will be selected for scholarships based on outstanding academic ability. In addition, demonstrated strongleadershipskills and extensive involvement in extracurricular activities will also be considered.
- Students whose firstlanguageis notEnglishmust refer to and meet Bond University's standard. English entry requirements for undergraduate applicants.
- English entry requirements for postgraduate applicants.
Selection Criteria
Successful applicants will be awarded these scholarships based on their ability to meet the eligibility criteria outlined
Scholarship Application Closing Date
- September 21, 2012
- January 25, 2013
- May 31, 2013
Application Submission
All international students who have made an application to study at Bond University (by the scholarship closing date for each semester) will be considered for an International Student Scholarship.
It is recommended that when students complete a Bond University Application Form, they submit a personal statement (outlining why you should be awarded a Bond scholarship), references, resume and certified copies of other relevant documentation to assist in supporting your application.
As part of the selection process, all shortlisted applicants will be required to participate in a telephone interview.
Selections for each intake of scholarship students are assessed based on academic merit. Should your submission not be successful at the time of application, your details will be reassessed for future semester intakes up until the point of acceptance.
Please note: Only short-listed applicants will be contacted for an interview. If you are not contacted for an interview by the dates stated in the general information above, then you can assume you have been unsuccessful in your application. Students will not be notified of their unsuccessful application in writing.
For further information, please contact:
Carlie Birt
Scholarship Coordinator
Phone: +61 7 5595 1028
Email: scholarships@bond.edu.au
For more information, please visitofficial website.
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- APEC MBA Scholarships, Nanyang Technological University, Singapore
- Singapore-MIT Alliance (SMA) Graduate Fellowship at SMART
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- Endeavour Postgraduate Awards for Master and PhD, Australia
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